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antenna assembly ASME Technical Publishing ASME to libraries Ball Grid Array BT substrate cable tie calculated coefficient components Copyright Copyright Clearance Center crack creep curve damage deformation developed die attach displacement drag coefficient dynamic effect elastic electroless Electronic Packaging enclosure material equation failure fastener fatigue finite element finite element analysis flip chip fracture toughness frequency granted by ASME grid array industry interconnects interface International Mechanical Engineering J-lead linear mast material properties maximum MDRR Mechanical Engineering Mechanical Engineering Congress modulus parameters PBGA plastic strain prediction pressure Printed in U.S.A safety factor Salem MA sensor shear shown in Figure simulation solder ball solder column solder joint reliability specimen stress analysis surface mount suspension teachers temperature tensile thermal cycling thermal loading thickness torque udcb UENF vehicle velocity vibration test viscoplastic Von Mises stress warpage