Electronic Materials Handbook: Packaging

Front Cover
ASM International, Nov 1, 1989 - Technology & Engineering - 1224 pages
4 Reviews
Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
  

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Contents

Design and Materials
1
Interconnection System Requirements and Modeling
12
Other Design Considerations
18
Electrical Design Methodologies
25
Thermal Mechanical and Environmental Durability
45
Design Considerations for HighFrequency
76
Materials and Electronic Phenomena
89
Materials and Processes Selection
112
Cleaning Materials
658
Adhesives for Surface Mounting
670
ThroughHole Soldering
681
SurfaceMount Soldering
697
Rework Processes
710
Joint Design and Quality
730
Performance Considerations
740
Solder Joints for MillimeterMicrowave Applications
754

Design for Assembly and Manufacture
119
Design for Life Cycle Optimization
127
Component and Discrete Chip Mounting
143
Active Digital Components
160
Passive Component Fabrication
178
Active Component Fabrication
191
Substrates and Packages
203
Die Attachment Methods
213
Electrical Interconnection
224
Package Sealing and Passivation Coatings
237
Hybrids and HigherLevel Integration
249
Overview of WaferScale Integration Technology
263
Overview of Tape Automated Bonding Technology
274
Overview of Multichip Technology
297
ThinFilm Hybrids
313
ThickFilm Hybrids
332
WaferScale Integration
354
Instrumentation and Testing
365
Commercial Applications
381
Future Trends
390
Packages
397
Design Considerations
408
Discrete Semiconductor Packages
422
Integrated Semiconductor Packages
436
Hybrid Packages
451
Ceramic Multilayer Package Fabrication
460
Plastic Package Fabrication
470
Lead Frame Materials
483
Environmental Testing for Commercial and Military
493
Printed Wiring Boards
505
Design
513
ComputerAided Design
527
Conventional Plastic Composite Boards
534
Solder Masks
553
Solderability Treatments
561
Printed Board Coupon Metallographic Evaluation
572
Other Printed Wiring Board Types
578
Substrate Properties Considerations
597
Thermal Expansion Properties
611
Soldering and Mounting Technology
631
Fluxes
643
Solder Pastes and Creams
651
Conformal Coatings and Encapsulants
759
Overview
761
Polyimide Coatings
767
SiliconeBase Coatings
773
Fluoropolymer Coatings
782
Parylene Coatings
789
Overview
802
Rigid Epoxies
810
Flexible Epoxies
817
Materials Characterization
825
Rheological Characterization
838
Photochemistry of Cycloaliphatic Epoxides
854
Quality Control Quality Assurance
867
Environmental Stress Screening
875
Accelerated Testing
887
Statistical Methods for Reliability Prediction
895
Military Standards
906
WaferLevel Physical Test Methods
917
PackageLevel Physical Test Methods
927
Component and BoardLevel Physical Test Methods
941
and MMICs
947
Special Test Procedures for Electronic Materials
953
Failure Analysis
957
Failure Mechanisms in ThroughHole Packages
969
Failure Mechanisms in SurfaceMounted Packages
982
Failure Mechanisms in Passive Devices
994
Failure Mechanisms in Active Devices
1006
Failure Mechanisms in Printed Wiring Boards
1018
Failure Mechanisms in Soldering
1031
Failure Mechanisms in Other Joining Techniques
1041
Failure Mechanisms in Coated and Encapsulated
1049
Electronic Failure Analysis Methods
1058
Special Imaging Techniques
1067
Surface Analysis
1074
Electron Optics
1094
Advanced Failure Analysis Techniques Used to Investigate
1102
Advanced Composite Packaging Materials
1117
Application of Composites in Packages
1126
Glossary of Terms
1133
Metric Conversion Guide
1163
Index
1169
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