Proceedings of the 1986 International Symposium on Microelectronics: October 6-8, 1986, Georgia World Congress Center, Atlanta, Georgia |
Contents
The Use of 3D Imaging for the Inspection of Hybrid | 42 |
Fast Low Cost Automatic Sheet Resistance and | 95 |
285 | 120 |
Copyright | |
42 other sections not shown
Common terms and phrases
adhesion strength alumina alumina substrates applications assembly automated automatic ball bond beam bond pad bond strength bonder capacitors carbon ceramic substrates chip circuit board coating components conductor materials copper cost cratering cycle defects developed device dielectric dissipation factor DuPont effect electrical Electronic evaluated failure fired film firing glass gold heat hybrid circuit inks inspection system interface ISHM kerf laser trimming layer machine vision manufacturers measured mechanical metal Microelectronics microns multilayer ohms operation optical inspection oxide package palladium parameters pattern performance photodiode plating POST MOLD CURE printed production reliability resistor rosin sample scanning screen sensor shear sheet resistance shown in Figure shows silicon silver conductor solder paste stress substrate surface mount Table tape techniques temperature tester thermal thermistor thick film thin film vision system voltage wire bonding