27th International Symposium on Microelectronics: 15-17 November 1994, Boston, Massachusetts |
Contents
Tuesday Morning Session | 49 |
Development of a PlasticEncapsulated Power | 84 |
Electrical Characterization of AIN BallPad Grid | 91 |
Copyright | |
14 other sections not shown
Common terms and phrases
adhesion alumina aluminum analysis antenna applications array assembly capacitance capacitors cavity ceramic characterization chip circuit components conductor copper cost crosstalk density developed devices diameter dielectric effect electrical Electronic Packaging etch evaluated fabrication factors flip-chip format frequency function gold ground plane heat hybrid IEEE IGBT impedance increase inductance integrated integrated circuits interconnect interface laser ablation layer lossy LTCC manufacturing mask material mBGA MCM-D measured meshes metal Microelectronics microstrip Microwave mils Multichip Module multilayer optical oxide parameters pattern performance photoresist pitch polyimide polymer Proc reliability resistance resistor samples scattering parameters semiconductor sensor shown in Figure shows signal silicon solder stress stripline structure substrate superconductor surface switching Tape technique temperature thermal conductivity thermal cycling thick film thin film tool transmission line vias voltage wafer wire bonding