27th International Symposium on Microelectronics: 15-17 November 1994, Boston, Massachusetts |
Contents
Tuesday Morning Session | 49 |
Howard Clearfield Ph D | 60 |
Optimiz | 66 |
Copyright | |
20 other sections not shown
Common terms and phrases
ablation addition adhesion analysis applications approach array assembly attach ball bonding bump cavity ceramic changes characterization chip circuit components conductivity conductor connected copper cost cycles density described determined developed devices dielectric effect electrical electronic elements etch evaluated experiment fabrication factors Figure format frequency function gold ground heat hybrid impedance improved increase inductance integrated interconnect laser layer lead loss manufacturing material measured mechanical metal method Microelectronics mils module mounted obtained operating package parameters pattern performance pitch plane polyimide presented properties reduced References reflection reliability resistance samples shown shows side signal silicon solder standard stress structure substrate surface switching Table Tape technique temperature thermal thick thin film tool transmission line vias voltage wafer wire