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1957 Pajka cinova acid activated ﬂux activated rosin adequate wetting alloy aluminium antimony applied ARAX brass brittle capacitors chloride clamp clean coating component terminations composition contact angle cool copper copper bit cored solder wire corrosion DIP-SOLDERING dipping dissolve electrical electronic electroplating ensure ERSIN Multicore eutectic excess solder extent of wetting Figure ﬂame ﬂow ﬂux residue ﬂux solution gold heat sinks impurities inch mass soldering metalware method molten solder Multicore PC Multicore Solders non-activated NUMBER oxide plating pre-tinning preform printed circuit boards quickly removed resin resin acids rosin ﬂux rosin-based ﬂuxes Savbit Section sheet silver soft-soldering solder alloy solder bath solder ﬂow SOLDER FORM SOLDER STANDARDS solder surface soldered joints soldering iron soldering iron bit soldering temperature solvent strength TABLE 3.1 continued thermal thermocouple tin content torch transistor usually wetting power WIRE STRIPPERS workpiece workpiece metal workpiece surface