Materials Science of Microelectromechanical Systems (MEMS) Devices IV: Volume 687Arturo A. Ayón Microelectromechanical systems (MEMS) has been able to successfully acceded to several markets, including pressure sensors, gyroscopes, accelerometers, fluidics and data storage, representing a total revenue of some $2 billion in 2000. However, MEMS has the potential to offer reliable and cost-effective solutions to many other fields. The current expectation is that we will witness the appearance of diverse MEMS structures for power generation, propulsion, biomedical applications, optical switching, infrared sensing, microphones and displays, to name just a few. This plethora of activity is possible due to the increased understanding of the properties of the micromanufacturing materials involved, the availability of processing equipment with enhanced capabilities, and the effort of a large number of researchers and scientists. This book, first published in 2002, focuses on the materials science of MEMS structures and the films involved to create those structures. Topics include: applications metrology; mechanical properties; microstructure and processing; applications; processing techniques; alternative materials; and surface engineering issues in MEMS structures and devices. |
Contents
Microsensors for Automotive Applications Metrology and Test | 3 |
ThreeDimensional Thermal Effects in MEMS Devices | 15 |
Piezoelectric Shear Mode Inkjet Actuator | 21 |
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2002 Materials Research Actuators annealing applied array bond bulk micromachined calculated coatings crack crevice corrosion crevice former crystal delamination density detector developed diaphragms dielectric electrode etching eutectic experimental failure fatigue feed horn films deposited fracture strength frequency fuel cell function gold grain hydrogen integration laser layer load Materials Research Society measured mechanical membrane MEMS MEMS antenna MEMS devices MEMS structures metal micro microelectromechanical systems microfabrication microfluidic micromachining microstructure microsystem modulus mold neutron notch optical oxide parameters photoresist Phys piezoelectric polymer polysilicon pressure Proc properties Pyrex PZT film range ratio residual stress resonance sample Schematic sensor shear shown in Figure shows silicon nitride silicon wafer simulations sintering SiO2 sol-gel specimen spectrometer standing wave stictioned strain stress concentration surface Symp techniques tensile testing TFTs thermal thick film thin films tonpilz transducers voltage wavelength Weibull wire bond Young's modulus