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Power Handling Capabilities of Hybrid Circuits
State of the Art in Design and Technology of
6 other sections not shown
adhesion alumina aluminium applications ball bonds capacitance capacitors CC-packages ceramic cermet chips coating coefficient components conductivity current noise curve dependence deposition angle devices dielectric diffusion dissipation dissipation factor effect electronic enamel encapsulated epoxy Erie etching evaporated experimental factor Figure filter firing cycles firing temperature frequency function geometry Ghent glass heat hybrid circuit IEEE increase input insulator integrated circuits L-cut layer lead frame manufacturers material measured mechanism mesh metal microcircuits Microelectronics NiCr obtained oxide package paper parameters particles pattern performance plastic preamplifier printed circuit board Proc produced range refiring screen printing semiconductor sensor sheet resistivity shown in Fig shows silicon sintering solar cell solder sputtering stability structure substrate TABLE technique thermal thick film resistors thin film thin film circuits transistors trimming tuning ultrasonic values voltage wedge bonds welding wire bonding