Microchip fabrication: a practical guide to semiconductor processing
Novice-friendly intro to semiconductor processing.The most readable and comprehensive guide to semiconductorprocessing, Peter Van Zant's Microchip Fabrication is considered the bible of basic microchip technology. Now in an updated new fourth edition, this completely math-free introduction to a complex field is an efficient tool for high-powered engineers and technology-clueless salespeople alike. You'll find fully illuminating, easy-reading explanations of semiconductor materials and process chemicals...contamination control...process yields...all aspects of basic patterning....doping,deposition, and metallization...wafer, device, and circuit evaluation...semiconductor devices and integrated circuit formation and types...and packaging. This new fourth edition puts at your fingertips new sections on: *Copper metallization and damascene patterning *BGA and CSP* Cutting-edge cleaning techniques *And more!
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The Semiconductor Industry
Semiconductor Materials and Process Chemicals
Crystal Growth and Wafer Preparation
16 other sections not shown
acid alignment alloy aluminum automation bake beam bipolar bonding Cahners Publishing called capacitors chamber Chap chemical chip clean room contamination cost crystal defects density deposition devices dielectric diffusion diode dopant dopant atoms doping electrical electrons epitaxial equipment etch exposed exposure fabrication area factors Figure film flow gallium arsenide gases gate heat holes increase inspection integrated circuit ion implantation junction light liquid LPCVD machines mask material measurement memory metal method MOS transistor negative resist operation oxide layer oxygen P-type package parameters particles pattern photomasking photoresist planar plasma polysilicon positive resist pressure problem process steps production pump reaction region removed resistors reticle rinse Semiconductor International sheet resistance silicon dioxide silicon nitride Solid State Technology solvent sputtering structure techniques temperature thermal thickness thin tion tube furnace vacuum vapor VLSI voltage wafer fabrication wafer surface wafer-sort yield