Proceedings, 1996 International Conference on Multichip Modules: April 17-19, 1996, the Marriott Tech Center, Denver, Colorado |
Contents
Hassan Hashemi Advanced Micro Devices | 52 |
Naveen Cherukuri JaiMin Liao Fujitsu Microelectronics Inc | 58 |
A Arnn J P Parkerson L W Schaper S S Ang HiDEC | 69 |
Copyright | |
13 other sections not shown
Common terms and phrases
ablation adhesive aluminum applications assembly Ball Grid Array burn-in capacitance capacitors carrier ceramic chip scale chip scale packaging ChipSeal circuit coating components configuration copper cure cycle defect deposition developed device DIEGO dielectric electrical electronic epoxy etch evaluation fabrication flex flip chip frequency functional grid hermetic high density integrated interconnect interface laminate laser layer low cost manufacturing mask material MCM-D MCM-L metal Multichip Modules oxide package parameters pattern performance photoresist pins pitch plating polyimide polymer probe probe card reflow reliability resistance resistors semiconductor shown in Figure signal silicon simulation solder bump spin coating sputtered SRAM standard stress structure substrate surface switching tape techniques Telebrás temperature tester thermal thermoplastic thickness thin film tool typical vias voltage wafer wire bonding wire button contact yield