Handbook of Multilevel Metallization for Integrated Circuits: Materials, Technology, and Applications

Front Cover
Syd R. Wilson, Clarence J. Tracy, John L. Freeman
Noyes, 1993 - Technology & Engineering - 887 pages
0 Reviews
It is widely recognized that the successful design, development, and integration of multilevel metallization (MLM) systems is and will continue to be key to current and future VLSI technologies. All major semiconductor companies have significant ongoing research teams focused in this area. These teams must view multilevel metallization as a system rather than a collection of isolated process modules. MLM teams are usually composed of unit process specialists and it is difficult for them to become generalists to solve the device, design, chemical, materials science, and analysis problems which are encountered. The engineers comprising these teams have been forced to accumulate and read large numbers of publications from each topical area to obtain a reasonably complete understanding of the numerous topics. The Handbook of Multilevel Metallization for Integrated Circuits answers this need by pulling together in one volume a thorough technical summary of each of the key areas that make up a multilevel metal system. Properly included are associated design, analysis, materials, and manufacturing topics. The book serves three purposes: (1) It is a good learning tool for the engineer newly assigned to work in metallization. All important aspects of the fully integrated process are discussed in sufficient depth such that no additional literature searches are needed. (2) It serves as a reference text for any MLM engineer, new or experienced, who needs a refresher about the specifics of a concept or process. (3) For someone who wants to further specialize in one topical area, an extensive listing of references has been provided to simplify more in-depth study.

What people are saying - Write a review

We haven't found any reviews in the usual places.

Related books

Other editions - View all

References to this book

All Book Search results »

References from web pages

Knovel - display
Handbook of Multilevel Metallization for Integrated Circuits - Materials, Technology, and Applications. Table of Contents Edited by: Wilson, sr; Tracy, cj; ...
www.knovel.com/ knovel2/ Toc.jsp?BookID=576

William Andrew: Handbook of Multilevel Metallization for ...
A thorough technical summary of each of the key areas that make up a multilevel metal system
www.williamandrew.com/ title.php?id=202

Method of fabricating a trench structure substantially filled with ...
A trench structure that is substantially filled with high-conductivity material such as refractory metal particularly suitable for fast switching trench ...
www.freepatentsonline.com/ 6737323.html

Layered structure with a silicide layer and process for producing ...
Layered structure with a silicide layer and process for producing such a layered structure - US Patent 5958505 from Patent Storm. A process for producing a ...
www.patentstorm.us/ patents/ 5958505-description.html

Interactive Library
... 0-8155-1340-2, William Andrew Publishing/Noyes, Handbook of Multilevel Metallization for Integrated Circuits - Materials, Technology, and Applications ...
www.shinwon.co.kr/ doc/ kesli/ Knovel%20Title%20list.xls

livre handbook of multilevel metallization for integrated circuits ...
livre circuits electriques electroniques, circuits hyper-frequences, micro-electronique : multilevel metallization engineers, both new and veterans
www.lavoisier.fr/ notice/ fr031126.html

Bibliographic information