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New Applications from New Materials Charles
Review and Perspective
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adhesion advanced composites aerospace aircraft applications aramid areas beams bonding boron boron filaments carbon fiber Carbon/Graphite chips components composite materials Compressive strength copper corrosion cost cure density design engineer diameter dielectric Dielectric constant drill dry-film E. I. du Pont electrical Electronic Packaging epoxy resin equipment fabrication fiber reinforced fiberglass filament winding flexible circuits glass cloth glass fibers graphite fibers hand lay-up heat high performance inch industry interconnection Kevlar Kevlar 49 laminate layers load manufacturing matrix resins mechanical properties metal molding Nomex panels photoresist pipe planes polyester polyimides polymer prepreg pressure Printed Circuit printed-circuit boards printed-circuit composites production properties attainable pultrusion Registered trademark reinforced plastics resin system ribs shown in Figure skin space specific stability steel surface Table tanks tape techniques temperature Tensile modulus Tensile strength thermal expansion thermoplastic thermoset Typical Properties U.S. Patent unidirectional variety vinyl ester weight yarns