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J The Deposit
4 Preparatory Steps of Plating
13 other sections not shown
acid bath acid copper acid dip active addition agents agitation alkaline alkaline cleaning alloy aluminum amount amp/sq ft amperes per square anode applied basis metal bond boric acid bright cadmium carbonate cathode efficiency changes chemical chloride chromic acid chromium cleaner coatings color concentration containing copper bath corrosion resistance current density cyanide copper deposit dilute Electrochem electrode electrodeposits electrolytic electroplating etching film flask fluoboric acid free cyanide g/l oz/gal gravity heat hydrochloric acid hydrogen impurities increase ions lead metal content methods mils ml distilled water ml sample NaCN NaOH nickel nickel bath obtained operated oxide phosphate pickling Pipette plating bath plating range plating rate plating test potassium potential produce removed rinse salts scale silver sodium cyanide sodium hydroxide sodium stannate soluble solvent stannous strike sulfate sulfuric acid surface tank temperature thickness throwing power tion titration treatment voltage zinc cyanide zincate