Proceedings of the ... International Microelectronics SymposiumInternational Society for Hybrid Microelectronics, 1976 - Microelectronics |
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active addition adhesion aging applications bonding capacitor ceramic characteristics chip circuit complete components composition conductance conductor copper cost cycles dependence determine devices dielectric DuPont effect electrical Electronic epoxy evaluated fabrication factor failure field Figure film resistors firing frequency function glass gold heat hybrid inch included increase indicate initial interconnection kerf laser layer lead less limited loss manufacturing materials measured mechanical metal method microcircuits microelectronics mils module networks noise obtained operation output oxide package parameters paste pattern performance plated present printed problems production properties pulse range reliability resistance resistor samples screen selected shear shown in Figure shows solder specifications standard strength substrate surface Table techniques temperature thermal thick film thin film tion trimming typical voltage width wire