Proceedings of the ... International Microelectronics SymposiumInternational Society for Hybrid Microelectronics, 1976 - Microelectronics |
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1/f noise adhesion alloy alumina aluminum amplifier applications ball bond capacitor ceramic Cermalloy chip coefficient components composition conductance conductor conductor materials copper curing cycles devices dielectric DuPont effect electrical Electronic epoxy etched evaluated exposure fabrication failure firing frequency function glass gold heat hybrid circuits hybrid microcircuits hybrid microelectronics inch increase indium input integrated circuits interconnection interface ISHM kerf laser trimming layer manufacturing materials measured metal micro microelectronics microwave mils module multilayer networks noise operation output oxide package pads parameters particles paste percent performance photoresist plated polyimide printed production properties pulse reliability samples screen semiconductor shear strength sheet resistivity shown in Figure shows stability substrate surface Table techniques temperature thermal thermosonic thick film resistors thin film tion transistors typical ultrasonic voltage width wire bonding