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Application of Laser Microsoldering to SMDs by Earl F Lish Martin 151 MIC Receiver Components Above 18 GHz by Dr Chandra Gupta Alpha Ind...
Chip Resistor Failures Associated with Solder Joint Degradation by Poster Session
A New Development in Solder Paste with Unique Rheology for 158 Silicon Solar Cell with ThickFilm Contact Electrodes and T102
36 other sections not shown
adhesion alloy alumina alumina substrate aluminum analysis annealing applications assembly ball bond capacitance capacitors ceramic substrate chip carrier coefficient components conductivity conductor conventional copper cure cycling developed devices dielectric constant dielectric resonator effect electrical Electronic epoxy etching evaluate fabrication fired film firing frequency furnace glass gold ground plane heat hybrid circuits inch increase integrated circuits interconnect interface laser laser trimmed layout leakage current levels manufacturing material measured metal method Microelectronics microstrip multilayer ND ND operation OVCC oxide package parameters pattern performance phase photoresist plating polyimide polymer production pull strength pull test reliability resistors robot samples screen printing scribe seal shear sheet resistivity shown in Figure shows silicon simulation solder joint squeegee substrate Table tape techniques temperature thermal thick film thin film tion transistor trimmed values voltage wire bonding