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air flow alloy analysis applied array bonding braze calculated channel CHF values chip cm/s cold plate cold-plate component condenser connector convection coolant cooling system correlation crack creep critical heat flux decrease deformation density dissipation effect Electronic Packaging ASME enclosure Engineering enhanced equation etching evaluation experimental fatigue Figure finite element finite element analysis finite element method flow rate fluid function glass plate heat pipe heat sink heat source heat transfer coefficient heater IC packages increase inlet interface layer liquid load material maximum measured mechanical method module Mudawar multi-chip multi-chip module nucleate boiling Nusselt obtained optimal Packaging ASME 1992 parameters performance pin fins plastic predicted pressure drop printed circuit board problem shear shear stress shown in Fig silicon simulated solder joint solution specimen stress subcooling substrate temperature test section thermal conductivity thermal resistance thermocouple thickness upflow vertical wall