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acid adhesive alloy aluminium aluminium nitride amorphous applications aramid bismuth bismuth system superconductor boron carbon fibre catalyst cells ceramic chemical coating components composites compounds comprises conductivity containing conventional copper CORP corrosion crystalline cure density developed devices diameter disc elastomer electrical electrolyte electronic ENGINEERING epoxy fabric fibre reinforced foam glass graphite heat heat deflection temperature high temperature improved industrial injection moulding insulation JAPAN laminated laser layer liquid crystal magnetic manufacture matrix melting metal method microns mixture modulus molecular moulding nickel nitride nylon optical fibre oxide particles PATENTS phase plasma plastic poly polyester polyimide polymer polymeric powder prepreg production PUBLIC RELATIONS DEPT range raw material resin resistance semiconductor sheet silicon carbide sintering solution solvent stability stainless steel structure substrate superconductor surface synthesized Telex tensile strength thallium thermal thermoplastic thick thin film tion titanium TOKYO toughness Use/Advantage viscosity whisker yttrium zinc