Solder mechanics: a state of the art assessment

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Minerals, Metals & Materials Society, 1991 - Technology & Engineering - 437 pages
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Contents

PHYSICAL METALLURGY OF SOLDER
1
PHYSICAL METALLURGY
29
HOT DEFORMATION OF TWO PHASE
107
Copyright

5 other sections not shown

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References from web pages

Micro-Mechanics of Fatigue Damage in Pb-Sn Solder Due to Vibration ...
Arrowood, R., Mukherjee, A. and Jones, W., 1990, Chapter 3 in Solder Mechanics: A State of the Art Assessment, Eds. Frear, D., Jones, wb and Kinsman, K., ...
ijd.sagepub.com/ cgi/ content/ refs/ 10/ 2/ 101

Stability of channels at a scalloplike cu6sn5 layer in solder ...
and C. Lea, Solder Mechanics: A State of the Art Assessment,. edited by dr Frear, wd Jones, and kr Kinsman (TMS, War-. rendale, PA 1991), p. 29. ...
www.mrs.org/ s_mrs/ bin.asp?CID=2273& DID=48754& DOC=FILE.PDF

The adhesion strength of A lead-free solder hot-dipped on copper ...
237. The Adhesion Strength of A Lead-Free. Solder Hot-Dipped on Copper Substrate. Journal of ELECTRONIC MATERIALS, Vol. 29, No. 2, 2000 ...
www.springerlink.com/ index/ L0N4538361346R05.pdf

Creep Behavior of the Ternary 95.5Sn-3.9Ag-0.6Cu Solder-Part I: As ...
J. Morris and Z. Mei, Solder Mechanics-A State of the Art Assessment, D. Frear, W. Jones, and K. Kinsman, eds. (Warrendale, PA: TMS, 1991), pp. 239-270. ...
findarticles.com/ p/ articles/ mi_qa3776/ is_200411/ ai_n9462775/ pg_11

Acta Materialia : Interface diffusion in eutectic Pb–Sn solder ...
Arrowood, R., Mukherjee, ak and Jones, wb, in Solder Mechanics—A State of the Art Assessment, ed. db Frear, wb Jones and kr Kinsman. ...
linkinghub.elsevier.com/ retrieve/ pii/ S1359645498003486

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jw Morris, Jr. and Z. Mei, in Solder Mechanics, A State of the Art Assessment,. dr Frear, wb Jones, kr Kinsman eds., TMS 1991. ...
www.osti.gov/ bridge/ servlets/ purl/ 10166529-fuRgHk/ 10166529.PDF

The dependence of the activation energies of intermetallic ...
THE DEPENDENCE. OF. THE ACTIVATION ENERGIES OF INTERMETALLIC FORMATION. ON THE COMPOSITION. OF. COMPOSITE snlpb SOLDERS. rfPinizzotto, egJacobs, Y.Wu, ...
ieeexplore.ieee.org/ iel2/ 1027/ 7007/ 00283322.pdf

Article comprising solder with improved mechanical properties - US ...
Article comprising solder with improved mechanical properties - US Patent 5346775 from Patent Storm. New solder compositions which can have improved ...
www.patentstorm.us/ patents/ 5346775-description.html

SOLDER JOINT CREEP AND STRESS RELAXATION DEPENDENCE ON ...
Paper submittal tothe ASME Journal of electronicp ackaging. SOLDER JOINT CREEP AND STRESS RELAXATION DEPENDENCE. ON CONSTRUCTION AND ENVIRONMENTAL-STRESS ...
trs-new.jpl.nasa.gov/ dspace/ bitstream/ 2014/ 35792/ 1/ 93-1518.pdf

Article comprising fine-grained solder compositions with ...
New solder compositions having enhanced mechanical properties are disclosed. Relatively inert particles having a diameter of 2000 nm or less are dispersed ...
www.freepatentsonline.com/ 5965197.html

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