Laser Assisted Processing: ECO1, 19-20 September 1988, Hamburg, Federal Republic of Germany : ProceedingsLucien D. Laude, Gerhard Rauscher |
Contents
Volume 1022 | 5 |
HIGH PRECISION LASER MACHINING | 19 |
DEPOSITION | 57 |
Copyright | |
3 other sections not shown
Common terms and phrases
ablation absorption Appl applications beam quality carbon chemical chemical vapor deposition chlorine compound cut edge Cutting Speed deposition rate depth electron endcap energy density epitaxial etching excimer laser experimental Figure films fluence focused fuse GaAs gauge factor geometry heat affected zone high power higher increase influence intensity distribution interaction irradiation laser beam laser cutting laser fluence laser irradiation laser processing laser pulse laser radiation sources laser source laser spot laser-induced layer m/min manufacturing martensite materials processing mbar measured mechanical melting metal Micro Machining mJ/cm² mode modulation obtained optical oxide phase photoablation photodiode Phys pigtail plasma polarization polymer power density processing parameters processing with laser properties pulse energy pulsewidth reaction roughness samples scanning sheet thickness shots shows silicon solder solder joint spot diameter steel sheets stoichiometry stripes substrate superpulsed surface techniques thermal threshold tion vapor wavelength welding workpiece