Proceedings of the 1988 International Symposium on Microelectronics: October 17-19 1988, Washington State Convention and Trade Center, Seattle, Washington

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International Society for Hybrid Microelectronics, Oct 1, 1988 - Hybrid integrated circuits - 571 pages
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Contents

Abe Osamu 217
84
Takahashi Yoshiro 139
88
Quality Failure Analysis and Reliability Composites for Potential Electronic Packaging Applications
145
Copyright

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