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NonContact Surface Profiling Using A Novel Capacitive
Stability of Reducing Resistance of Thick Film Resistors by R Ehlert Hughes Aircraft Company
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adhesion alumina aluminum analysis applications assembly attach beryllia bump capacitors ceramic circuit cofired components composite conductor configuration copper cost cycle density deposition developed device diamond dielectric constant dissipation factor effect electrical Electronics epoxy etch evaluated fabric factors fired flip chip flux frequency glass gold Green Tape heat heat sink hybrid Hybrid Circuit increase insulating interconnect interface ISHM laminate laser layer manufacturing material MCM-D MCM-L measured mechanical metal method Microelectronics Multichip Modules multilayer nichrome oxide package parameters particles pattern performance pitch polyimide printed probe Proc properties reflow reliability resistor samples semiconductor shear shown in Figure shows shrinkage signal silicon silver sintering solder joints solder paste strength stress structure substrate superconducting surface mount Table technique temperature thermal conductivity thermal resistance thermistor thick film thin film transmission line vias voltage weld wire bond