Solder Joint Reliability: Theory and Applications

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John H. Lau
Springer US, May 31, 1991 - Computers - 631 pages
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Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solder is the electrical and me chanical "glue" of electronic assemblies. This pervasive dependency on solder has stimulated new interest in applica tions as well as a more concerted effort to better understand materials properties. We need not look far to see solder being used to interconnect ever finer geo metries. Assembly of micropassive discrete devices that are hardly visible to the unaided eye, of silicon chips directly to ceramic and plastic substrates, and of very fine peripheral leaded packages constitute a few of solder's uses. There has been a marked increase in university research related to solder. New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them. Industrial research and development continues to stimulate new application, and refreshing new packaging ideas are emerging. New handbooks have been published to help both the neophyte and seasoned packaging engineer.

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About the author (1991)

John H. Lau received his PhD in theoretical and applied mechanics from the University of Illinois, an MASc in structural engineering from the University of British Columbia, a second MS in engineering physics from the University of Wisconsin, and a third MS in management science from Fairleigh Dickinson University. He also has a BE in civil engineering from National Taiwan University. John is an interconnection technology scientist at Agilent Technologies, Inc. His current interests cover a broad range of optoelectronic packaging and manufacturing technology.

Prior to coming to Agilent, Lau worked for Express Packaging Systems, Hewlett-Packard, Sandia National Laboratory, Bechtel Power Corporation, and Exxon Production and Research Company. With more than 30 years of R&D and manufacturing experience in the electronics, photonics, petroleum, nuclear, and defense industries, he has given over 200 workshops and invited presentations, authored and coauthored over 200 peer-reviewed technical publications, authored more than 100 book chapters, and is the author and editor of 14 books on IC packaging.

Lau has served on the editorial boards of "IEEE Transactions on Components, Packaging and Manufacturing Technology, " and "ASME Transactions, Journal of Electronic Packaging." He also has served as general chairman, program chairman, session chairman, and invited speaker at several ASME, IEEE, ASM, MRS, IMAPS, SEMI, and SMI International conferences. He has received many awards from the ASME and IEEE for best proceedings and transactions papers and outstanding technical achievements and is one of the distinguished lecturers of the ASME and IEEE/CPMT. He is an ASME Fellow and IEEE Fellow and is listed in "American Men and Women of Science" and "Who's Who in America."

C.P. Wong is a Regent's Professor at the School of Materials Science and Engineering and a Research Director at the NSF Packaging Research Center at the Georgia Institute of Technology. He received his BS in chemistry from Purdue University, and his PhD in chemistry from Pennsylvania State University with Nobel Laureate Professor Henry Taube.

Wong spent 19 years at AT&T Bell Labs and was elected a Bell Labs Fellow in 1992. His research interests lie in the fields of polymeric materials, reaction mechanism, IC encapsulation, hermetic equivalent plastic packaging, electronic packaging processes, interfacial adhesions, PWB, SMT assembly, and component reliability.

He has received many awards, among which are the AT&T Bell Laboratories Distinguished Technical Staff Award (1987), the AT&T Bell Labs Fellow Award (1992), the IEEE Components, Packaging and Manufacturing Technology (CPMT) Society Outstanding and Best Paper Awards (1990, 1994, 1996, 1998, and 2002), the IEEE Technical Activities Board (TAB) Distinguished Award (1994), the IEEE CMPT Society's Outstanding Sustained Technical Contribution Award (1995), the Georgia Tech Outstanding Faculty Research Program Development Award (1999) and many others.

Wong was elected a member of the National Academy of Engineering in 2000, and he is a Fellow of the IEEE, AIC, and AT&T Bell Labs. He served as technical vice president (1990 and 1991) and president (1992 and 1993) of the IEEE-CPMT Society, the IEEE TAB Management Committee (1993 to 1994), and chair of IEEE TAB Design and Manufacturing Committee (1994 to 1996), the IEEE Nomination and Appointment Committee (1998 to 1999), and the IEEE Fellow Committee (2001-present).

Ning-Cheng Lee is the vice president of technology of Indium Corporation of America. He has been with Indium since 1986. Prior to joining Indium, he was with Wright Patterson Air Force Base Materials Laboratory (1981 to 1982), Morton Chemical (1982 to 1984), and SCM (1984 to 1986). He has more than 18 years of expe