Solder Joint Reliability: Theory and Applications
John H. Lau
Springer US, May 31, 1991 - Computers - 631 pages
Looks at how solder joint reliability is influenced by flux reactions, solder paste, reflow methods, wave soldering, and cleaning. Explores failure mechanisms and includes practical methods for testing, analysis, and life prediction of solder joints subjected to conditions of fatigue, creep, stress relaxation, shock, and vibration. For engineers and designers involved in electronics packaging. Annotation copyrighted by Book News, Inc., Portland, OR
What people are saying - Write a review
We haven't found any reviews in the usual places.