1995 International Symposium on Microelectronics: Proceedings : 24-26 October, 1995, Los Angeles Convention Center, Los Angeles, California, Volume 2649

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ISHM-The Microelectronics Society, 1995 - Microelectronics - 562 pages
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Contents

Hard Ball Grid Arrays for Pluggable BGA I
1
on Pop Corn 077 AlSiC Technology for Reliable and Thermally Demanding
18
Voiding Mechanism in BGA Assembly 083 Metal Impregnated Carbon Composites
24
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