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Semiconductor Process Control
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A. H. Sher analysis annealed ASTM calibration carrier lifetime circuit determined device under test diffused-junction detectors diffusion diodes doping density effects EIA-JEDEC emitter emitter-only switching extraneous signals F. F. Oettinger fabrication function of loop generation-recombination-trapping centers gold acceptor gold density gold-doped silicon hot spot included infrared response Integrated Circuits J. C. French loop height measured pull strength Measurement for Semiconductor ment methods of measurement microwave diodes mixer n-p-n transistors n-type silicon National Bureau NBS Cost Center NBS Tech obtained oscillator power p-n Junction p-type percent power semiconductor devices Power Transistors probe assembly probe loading probe tips procedures Process Control pull test resolution-of-forces calculation ribbon ribbon-wire bonds round-wire bonds S-parameter S-parameter measurements Scattering Parameter Section semiconductor devices Semiconductor Materials spectrum types standardization activities surface photovoltage Task temperature sensitive parameter thermal resistance thermal resistance measurements thermal response thermistor U.S. Navy W. M. Bullis wafers wire bonds