1998 International Conference on Multichip Modules and High Density Packaging

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Institute of Electrical and Electronics Engineers, 1998 - Business & Economics - 547 pages
Now in its seventh year, MCM has expanded to reflect the evolution and applications since 1992. The MCMs most commonly envisioned in 1992 interconnected 60 to 100 chips on a thin film substrate.

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Contents

Building a Domestic High Density Flip Chip Organic Hideki Kusamitsu Y Morishita K Maruhashi M
1
Adhesion Evaluation of Adhesiveless Metal Lee University of Colorado
7
Multichip Packaginc in QFPs by PBOMultilayer
29
Copyright

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