Active Electronic Component Handbook
Charles A. Harper, Harold C. Jones
McGraw-Hill, Jan 1, 1996 - Technology & Engineering - 672 pages
A new edition of the classic guide to design data for modern electronic components The completely revised and updated edition of this best-selling handbook provides the latest data, information, and design guidelines for all engineers who designs, manufacture, and use active components in electronic systems. The Second Edition offers you an expert account of the nature and types of active components in electronic systems. The Second Edition offers you an expert account of the nature and types of active components presently in use--and also discusses the importance of developing the right supplier-user team for optimizing the application of these components in electronic systems. You'll find entirely new chapters on microwave and optoelectronic components, plus up-to-the-minute coverage of programmable logic and application specific integrated circuits (ASICs). . .memory devices. . .microprocessors and microcontrollers. . .microwave devices. . .hybrid and multichip module devices. . .discrete semiconductors. . .display devices. . .and photonic components. Featuring 700 helpful illustrations, this definitive reference tool will give you the detailed information and expertise required to select and use the best components and component systems for your electronic and electrical product designs.
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Programmable Logic and ApplicationSpecific
Memory Devices 3 1
Microprocessors and Microcontrollers 4 1
6 other sections not shown
amplifier antifuse applications architecture ASIC bandwidth basic beam BiCMOS bipolar bits capacitance capacitor cavity cell channel characteristics charge chip CISC clock CMOS color components configuration cost cycle density devices dielectric diode display DRAM efficiency electrical electron EPROM FIGURE flash memory FPGA frequency function GaAs gate array HDTV HEMT holes hybrid IEEE increases input integrated circuit interconnect interface laser layer logic magnetic manufacturing mask material metal microprocessors Microwave mode module noise operation optical fiber output oxide P-N junction package parameters percent performance photodetector photon potential problem processor programming pulse readout reliability resistors result RISC screen semiconductor shadow-mask shown in Fig signal silicon speed SRAM standard structure substrate supplier switching techniques temperature thermal tion transistor tube typical VCSEL voltage wafer waveguide wavelength wire wire bonding Xilinx