Advanced Metallization Conference 2005 (AMC 2005):

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S. H. Brongersma, T. C. Taylor, M. Tsujimura, K. Masu
Materials Research Society, Jan 1, 2006 - Technology & Engineering - 755 pages
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Technical leaders from around the world gather here to discuss developments in the areas of interconnect performance, advanced metallization, low-dielectric constant materials, barrier metallization, atomic layer deposition, advanced packaging and vertical integration. Both current state-of-the-art and ongoing challenges associated with multilevel interconnect are addressed. Included are papers on the latest developments in the integration of low-dielectric constant materials with copper-based metallization, and advances in the understanding of means by which process- or stress-induced damage can be mitigated and reliability of the interconnect system improved. Additional contributions discuss the design, development and modeling of advanced on-chip and multichip interconnect architectures and real-world implementation of optimized designs, materials and processes for production of leading-edge microelectronic devices.

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The Impact of Wave Pipelining on Future Interconnect
Interconnect Modeling and Analysis in the Nanometer
High Frequency Characterization of CopperLowk

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