Advanced Metallization and Interconnect Systems for ULSI Applications in 1996:, Volume 12

Front Cover
Materials Research Society, 1997 - Computers - 608 pages
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The scope of this volume has gradually expanded from its initial focus on metal deposition to include all aspects of multilevel interconnect fabrication including conductors, dielectrics, planarization, integration and reliability. At the same time, it has also retained its original emphasis on leading-edge material, interface and process science that has made the series so unique. The volume features a keynote address on "Scaling High-Performance Interconnects".

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Scaling of HighPerformance Interconnects
The Chemical Vapor Deposition of Aluminum
Overview of HighPressure Aluminum Processing for ULSI

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