Applications of Experimental Mechanics to Electronic Packaging
American Society of Mechanical Engineers, 1995 - Electronic packaging
Papers presented at the ASME International Mechanical Engineering Congress and Exposition.
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Fatigue and Cyclic Deformation Behavior of High Temperature
Thermal Analysis Modeling and Investigation of Die Attach Void
Application of Photoelasticity in Determining the Stress Intensity Factor
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adhesive alloy analysis attach voids Auburn University Ball Grid Array bimaterial birefringence calculated chip center compressive stress crack initiation creep crystal cyclic deformation delamination device EEP-Vol elastic Electronic Components Electronic Packaging Conference encapsulant resin epoxy eutectic Experimental Mechanics fabricated fatigue finite element analysis finite element model four-point bending fracture IEEE in-plane interface laser layers loading LSI chip material maximum Mechanics to Electronic metal width method Microelectronics Moire Interferometry n-type n-type resistors Niitsu off-axis optical orientation parameters photoelastic piezoresistive coefficients Piezoresistive Stress Sensors Plastic Packages plate predicted printed wiring board Proceedings reliability residual stress resistance change resistors rosettes sample semiconductor sensor rosettes shear stress shown in Figure silicon wafer solder joint specimen stress components stress distribution Stress Measurement substrate Suhling technique temperature compensated temperature cycling test test chip thermal resistance thin film Transient Moire transient thermal transistors values Voloshin wafer-level calibration