Applications of Experimental Mechanics to Electronic Packaging

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American Society of Mechanical Engineers, 1995 - Electronic packaging
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Papers presented at the ASME International Mechanical Engineering Congress and Exposition.

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Contents

Fatigue and Cyclic Deformation Behavior of High Temperature
1
Thermal Analysis Modeling and Investigation of Die Attach Void
11
Application of Photoelasticity in Determining the Stress Intensity Factor
17
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