Atomistic simulation of Cu/Ta thin film deposition and other phenomena
Contents include: Introduction, Thin Ta films: growth, stability, and diffusion studied by molecular dynamics simulations, Molecular dynamics study of Cu thin film deposition on B-Ta, Molecular dynamics simulations of Cu/Ta and Ta/Cu thin film growth, The interaction of N with atomically dispersed Ti, V, Cr, Mo, and Ni in ferritic steel, Density functional theory study of alloy element interstitials in Al, Summary.
What people are saying - Write a review
We haven't found any reviews in the usual places.
growth stability and diffusion studied by Molecular
Molecular Dynamics study of Cu thin film deposition on PTa
Molecular Dynamics simulations of CuTa and TaCu thin film growth
5 other sections not shown
activation energy adatom alloy atoms alloy interstitial alloying elements annealing atomen atomic volume atomically dispersed B.J. Thijsse clusters cohesion energy coordination crevices crystal structure crystallites Cu/Ta Density Functional Theory DFT calculations DFT data dimer dislocations disordered distance dumbbell dumbbell and octahedral EAM potentials electromigration electron density Embedded Atom Method energy difference epitaxial equilibrium film deposition film grown flat bcc grain boundaries heat of formation heat of solution hexagonal plane in-plane interaction interconnects intermediate plane interstitial configurations interstitiŽlen korrels Kresse lattice legeringsatomen Mater MEAM metals microstructure Molecular Dynamics Molecular Dynamics simulations monolayer nitriding nitrogen octahedral octahedral configuration outer plane P-Ta substrates pair potential parameter Phys potential energy relaxation room temperature self-interstitial silicon stacking faults steel substraten T.P.C. Klaver Ta-Cu Ta/Cu thermal thin films Thin Solid Films trapping tussen unit cell vacancy diffusion vacancy formation energy vacature VASP verschillende zijn