CAE/CAD and thermal management issues in electronic systems: presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas

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Contents

Characterisation of OpenCell Aluminum Alloy Foams as Heat Sinks for High
1
ThermoMechanical Analysis of SolderSealed Electronic Modules During Power
7
Parametric Study of Thermal Performance of a Plastic Ball Grid Array Single Package
13
Copyright

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