Electrical, thermal, and architecture aspects of VLSI packaging and interconnects for high-speed digital computers

Front Cover
Cornell University, May, 1989 - Computers - 594 pages
0 Reviews

From inside the book

What people are saying - Write a review

We haven't found any reviews in the usual places.

Contents

FUNDAMENTAL LIMITATIONS
14
ELECTRONIC PACKAGING DESIGN SPACE
51
IMPORTANT ASPECTS OF PACKAGE DESIGN
68
Copyright

12 other sections not shown

Common terms and phrases

Bibliographic information