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Design for Plating J Hymer
Typical Processing and Operating Sequences
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A/dm abrasive agitation alkaline alloys aluminum anode applications ASTM atoms barrel basis metal brass bright buffing cadmium carbon cathode chemical chloride chromic acid chromium cleaning coating coils composition concentration containing copper corrosion current density cyanide cycle cylinder deposit electrical Electrochem electrode electrodeposits Electroforming electroless electrolyte electroplating electropolishing equipment film filter flow fluoborate fluoboric acid g/L oz/gal heat hydrochloric acid hydrofluoric acid hydrogen hydroxide immersion installation ions iron layer load machine mandrel materials ment Metal Finishing method mist nickel nitric acid operation oxide phosphate pickling plastic plating baths plating solution polishing production pump rack reagent rectifier removed resistance silver sludge sodium sodium hydroxide solvent specific spray stainless steel standard strip substrate sulfate sulfuric acid surface Table temperature thickness tion treatment U.S. Patent usually vapor degreasing voltage zinc