Green Electronics Manufacturing: Creating Environmental Sensible Products

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CRC Press, Jul 25, 2012 - Technology & Engineering - 360 pages

Going "green" is becoming a major component of the mission for electronics manufacturers worldwide. While this goal seems simplistic, it poses daunting dilemmas. Yet, to compete effectively in the global economy, manufacturers must take the initiative to drive this crucial movement. Green Electronics Manufacturing: Creating Environmental Sensible Products provides you with a complete reference to design, develop, build, and install an electronic product with special consideration for the product’s environmental impacts during its whole life cycle.

The author discusses how to integrate the state-of-the-art technologies of finite element method (FEM) modeling, simulation, and testing to create environmental sensible products of satisfying global environmental regulations, such as Restriction of Hazardous Substances (ROHS) compliance. He covers enabling techniques such as advanced fatigue life modeling, crack propagation analysis, and probabilistic robust design of lead-free electronics. The book also explores how risk engineering methodology empowers practitioners with effective tools such as buckling analysis of tin whiskers.

With its emphasis on reducing parts, rationing materials, and reusing components to make products more efficient to build, green electronics intertwines today’s electronics with manufacturing strategies of global sourcing, concurrent engineering, and total quality. Implemented through product and process design, it can help you achieve sustainability to support future generations and at the same time preserve our natural resources. Green Electronics Manufacturing: Creating Environmental Sensible Products gives you the tools to create environmental sensible products while maintaining electronics quality and reliability.

 

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Contents

Strategic Industry Interconnection Direction
1
New Challenge for LongTerm RoHS Reliability
25
3 Fatigue Characterization of LeadFree Solders
45
Finite Element Modeling
67
Fatigue Life Model
91
Higher Temperature
117
7 Fatigue Design of LeadFree Electronics and Weibull Distribution
141
8 Enhancing Reliability of Ball Grid Array
175
9 Finite Element Modeling under HighVibration and HighTemperature Environments
197
10 Probabilistic Modeling of the ElasticPlastic Behavior of 63Sn37Pb Solder Alloys
213
11 FlipChip Assembly for LeadFree Electronics
235
12 FlipChip Bonding Technique for LeadFree Electronics
257
13 FlipChip Bonding of OptoElectronic Integrated Circuits
283
14 Lets Package a LeadFree Electronic Design
307
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About the author (2012)

Dr. John X. Wang, a manager of reliability engineering at Maytag Corporation, taught Maytag(TM)s Design for Six Sigma training courses. He served as Six Sigma Master Black Belt certified by Visteon (where he led Design for Six Sigma training programs) and as Six-Sigma Black Belt certified by General Electric (where he led Design for Six Sigma best practice projects). He has been an American Society for Quality Certified Reliability Engineer and an International Quality Federation Certified Six Sigma Master Black Belt.
0131448552AB02172005

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