Heat Conduction with Maple

Front Cover
R.T. Edwards, 2005 - Technology & Engineering - 279 pages
This book is the first heat transfer book that uses Maple in the study of heat conduction. The book covers elementary and advanced one-dimensional steady conduction, two-dimensional steady conduction, transient conduction, oscillatory conduction, extended surfaces and special functions. The use of Maple facilitates and enhances the learning process by removing the tedium of algebraic manipulations and providing a powerful numerical and graphical tool for heat conduction analysis and design. Highlights of this book include: - An overview of Maple to give the reader a quick working knowledge - Examples drawn from traditional and contemporary topics in heat conduction - Presents symbolic analytic, numerical and graphical solutions simultaneously - Coverage of special functions, laplace transformation, similarity analysis, and the method of complex combination - Comprehensive coverage of extended surfaces including electronics cooling - Implemenation of finite difference solution strategies - Optimization techniques for thermal system design Heat Conduction with Maple can be used as self-contained study of heat conduction and/or as a supplement to existing textbooks. The reader will master a powerful tool that that can be utilized to pursue new and challenging problems not only in conduction but also in convection and radiation.

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