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Laser Dicing of Chip Scale and Wafer Scale Packages
Todd Lizotte NanoVia
Precision Flux Deposition Techniques for Semiconductor Applications
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2003 IEEE/CPMT/SEMI Int'l adhesion alloy analysis applications automation ball bond ball grid array capillary ceramic chip scale packages circuit components copper cost cure device dicing die attach dielectric electrical Electronics Manufacturing Technology epoxy equipment etch failure flip chip flip chip assembly flow flux frequency HyperBGA IEEE/CPMT/SEMI Int'l Electronics increase inspection Int'l Electronics Manufacturing integrated interconnect interface JEDEC laminate laser layer leadframe LTCC Manufacturing Technology Symposium measured metal microns module moisture molding compound optimized output parameters passive performance pitch placement plating polymer probe card reduce reliability resistance sample semiconductor shown in Figure shows signal silicon simulation solder ball solder bump solder joints solder paste solution stacked package standard stencil stress structure substrate surface Table temperature tester thickness tool typical underfill material underfill process wafer bumping warpage wire bonding WLCSP x-ray