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Solder Bump Flip Chip Fabrication Using
The Influence of SESSION Ill HYBRID MANUFACTURING TECHNOLOGY
High Temperature Viscosity Control in MultiLayer
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abrasive adhesion alumina aluminum analysis application beam lead beryllia bond strength capacitors ceramic chip coating components conductor materials copper curing cycles density deposition developed devices dielectric electrical Electronic EMCA emulsion epoxy etched eutectic evaluation fabrication failure firing flip chip fritless glass gold grams-force heat heater hermetic hybrid circuits inch interconnection kerf laser trimming layer lead frames manufacturing measured mechanical mesh metal method microcircuits microelectronic module moisture multilayer operation oxide package parameters paste percent performed photo emulsion problems process control production reliability resistance resistor sample screen printing sealing semiconductor sheet resistivity shown in Figure shows silicon solder alloy stability substrate surface Table techniques temperature test pattern thermal thick film thick film pad thick film resistor thin film tion tool transistor ultrasonic voltage weld schedule width wire bonding