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H CERAMIC PROCESSES
3J Forming Processes
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activation energy addition alkali alumina applied atoms barium titanate bond carbide cation ceramic ceramic materials clay composition concentration cooling corresponding cristobalite crystalline crystals curve decreases deformation density diagram dielectric constant diffusion coefficient discussed in Chapter dislocation effect electrical conductivity electron electron hole enamels equilibrium expansion coefficient feldspar firing forsterite fraction fracture glass glaze grain boundaries grain growth heat high temperatures illustrated in Fig impurities increases interface interstitial ionic lattice layer liquid magnetic metal mullite noncrystalline normal nucleation observed occurs oxide oxygen ions particle perature phases present plastic polarization porcelain pores porosity pressure properties quartz range ratio reaction refraction refractory result sample shown in Fig shrinkage silicate silicate glasses sintering sodium sodium chloride solid solution stable strength stress structure surface energy temperature dependence thermal conductivity tion transformation tridymite ture vacancies vapor viscosity vitrification volume ware