Lead-Free Solder Interconnect ReliabilityDongkai Shangguan |
Contents
| 48 | |
XIV | 67 |
XV | 69 |
XVI | 87 |
XVII | 103 |
XVIII | 107 |
XIX | 108 |
XX | 109 |
XXI | 111 |
XXII | 113 |
XXIII | 116 |
XXIV | 123 |
XXV | 129 |
XXVI | 131 |
XXVII | 132 |
XXVIII | 137 |
XXIX | 142 |
XXX | 143 |
XXXI | 147 |
XXXII | 148 |
XXXIII | 149 |
XXXIV | 151 |
XXXV | 152 |
XXXVI | 153 |
XXXVII | 161 |
XLVII | 191 |
XLVIII | 194 |
L | 199 |
LI | 200 |
LII | 208 |
LIII | 209 |
LV | 214 |
LVI | 220 |
LVII | 222 |
LIX | 227 |
LX | 228 |
LXI | 239 |
LXII | 241 |
LXIV | 245 |
LXV | 249 |
LXVI | 251 |
LXVII | 255 |
LXVIII | 263 |
LXIX | 273 |
LXX | 277 |
LXXI | 278 |
LXXIV | 279 |
LXXV | 283 |
LXXVI | 285 |
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Common terms and phrases
accelerated test Ag3Sn analysis area array packages assemblies atoms b-Sn ball grid array CBGA chip Components and Technology Conductive Adhesive crack creep deformation creep rate creep strain defined diffusion effect electrical ENIG eutectic eutectic Sn-Pb failure fatigue field fillers finite element first Flip Chip flip-chip flux fracture free solder grain boundary ICA joints IEEE interface interfacial IMC intermetallic lead-free solder Lead-Free Solder Joints loading material mechanical metal microstructure negative creep oxide package parameters particles Pb-free solders PBGA perature phase plastic prediction profile range reflow resistance sample Shangguan shear shown in Fig significant Sn whisker Sn-Ag Sn-Ag-Cu solder Sn-Cu Sn-Pb Sn-Pb solder solder balls solder interconnects solder joint solder paste solidification specific strain rate stress substrate Surface Mount test temperatures thermal cycling thickness tin-lead solder tion ture underfill wave soldering whisker growth x-ray
Popular passages
Page 275 - IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part B, vol 19, no.
Page 21 - Directive 2002/95/EC of the European Parliament and of the Council on the restriction of the use of certain hazardous substances in electrical and electronic equipment (RoHS).
Page 163 - Growth and Perfection of Crystals, RH Doremus, BW Roberts, and D. Turnbull, Eds., Wiley, New York, 1958, p.
Page 183 - G is the shear modulus, b is the Burgers vector, k is Boltzmann's constant, T is the absolute temperature...
Page 129 - Soldering2 is defined as the process of joining metallic surfaces with solder without the melting of the basis metal. In order for this joining to take place, the metal surfaces must be clean of contamination and oxidation. This cleaning action is performed by the flux,2 a chemically active compound which, when heated, removes minor surface oxidation, minimizes oxidation of the basis metal, and promotes the formation of an intermetallic layer between solder and basis metal.
Page 63 - Dissolution of Au, Ag, Pd, Pt, Cu, and Ni in a Molten Tin-Lead Solder", Welding Research Supplement, Dec.
Page 127 - Effect of Thermal Aging on Board Level Drop Reliability for Pb-free BGA Packages," Proceedings of the 54lh Electronic Components and Technology Conference (IEEE), May 2004, pp.
Page 64 - Rreactions," in Solder Mechanics: A State of the Art Assessment, DR Frear, WB Jones, and KR Kinsman, editors, 47-49, TMS, December 15, 1990. [42] GM Wenger, "Immersion Gold Surface Finish Characterization,
Page 104 - Standard Test Methods of Compression Testing of Metallic Materials at Room Temperature.