Metallization of Polymers 2
Springer Science & Business Media, Sep 30, 2002 - Science - 208 pages
As the demands put on the polymer/metal interface, particularly by the microelectronics industry, become more and more severe, the necessity for understanding this interface, its properties and its limitations, becomes more and more essential. This requires a broad knowledge of, and a familiarity with, the latest findings in this rapidly advancing field. At the very least, such familiarity requires an exchange of infonnation, particularly among those intimately involved in this field. Communications among many of us in this area have made one fact quite obvious: the facilities provided by existing organizations, scientific and otherwise, do not offer the forum necessary to accomplish this exchange of infonnation. It was for this reason that Jean-Jacques Pireaux, Steven Kowalczyk and I organized the first Metallization of Polymers, a symposium sponsored by the American Chemical Society, which took place in Montreal, September 25-28, 1989; the Proceedings from that symposium were published as ACS Symposium Series 440, (1990). It is this same per ceived lack of a proper forum, and the encouragement of my colleagues, that prompted me to organize this meeting, so as to bring to the attention of the participants new instruments, materials, methods, advances, and, particularly, thoughts in the field of polymer metalliza tion. The meeting was designed as a workshop, with time being made available throughout for discussion and for the consideration of new findings.
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SURFACE ANALYSIS USING CONFOCAL RAMAN MICROSPECTROSCOPY
THIN FILM VERSUS NANOPARTICLE
ULTRA THIN FILM ANALYSIS USING THERMO VG SCIENTIFICS THETAPROBE INSTRUMENT
NANOINDENTATION OF MICROSPRINGS AND MICROCANTILEVERS
SILK AND ULTRALOW K
MECHANICAL PROPERTIES OF CURED SiLK LOWK DIELECTRIC FILMS
PLASMAPOLYMERIZED FLUOROPOLYMER THIN FILMS FOR MICROELECTRONIC APPLICATIONS
FUNDAMENTAL ASPECTS OF POLYMER METALLIZATION
ADSORPTION OF NOBLE METAL ATOMS ON POLYMERS
NUCLEATION AND GROWTH OF VAPORDEPOSITED METAL FILMS ON SELFASSEMBLED MONOLAYERS STUDIED BY MULTIPLE CH...
MORPHOLOGICAL INVESTIGATIONS OF LOWk POLYMERDIFFUSION BARRIER INTERFACES FOR 1C METALLIZATION
CHEMISTRY IN THE INITIAL FORMATION OF NITRIDE BARRIERS ON LOWK DIELECTRICS
CAPABILITIES AND LIMITATIONS OF RBS TO CHARACTERIZE HYPERTHIN SILICON COMPOUND LAYERS ON VARIOUS POLYMERIC ...
SURFACE MODIFICATION BY ION ASSISTED REACTION
PLASMA AND VUV PRETREATMENTS OF POLYMER SURFACES FOR ADHESION ENHANCEMENT OF ELECTROLESSLY DEPOSITED NI...
THE STUDY OF COPPER CLUSTERS ON DOW CYCLOTENE AND THEIR STABILITY
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adhesion analysis annealing barrier layer binding energy bond carbon chemical cluster density condensation coefficient confocal constant contact angle copper Cyclotene decrease deposition rate dielectric function Edward Sacher electroless electron ellipsometry evaporation experimental Faupel fluoropolymer formation glass transition temperature groups growth HOPG hydrophilic increase intensity interaction interface ion beam ion dose ion irradiation ions/cm2 Kapton low-k materials measurements metal atoms metal clusters Metallization of Polymers Meth microscope microspring modulus nitride nitrogen noble metals Nucl nucleation observed OFCB plasma off-specular optical oxide oxygen particle peak Phys plasma polymerization plasma treatment polycarbonate polyimide polymer surface PPOFCB PTFE PVDF Raman reaction reactive room temperature sample scattering shown in Figure shows silicon SilK film SiO2 species spectra spectroscopy spectrum sputtering stack structure Strunskus substrate surface energy tantalum tantalum nitride Technol thermal thickness thin films TiSiN TiSiN/SiLK treated polymer values wettability x-ray Zaporojtchenko
Page 205 - MK Shi, A Selmani, L Martinu, E Sacher, MR Wertheimer and A Yelon, J. Adhesion Sci. Technol, 8(10) (1994) 1129.