Microwave and Millimeter-Wave Electronic Packaging

Front Cover
Artech House, Dec 1, 2013 - Technology & Engineering - 261 pages

Packaging of electronic components at microwave and millimeter-wave frequencies requires the same level of engineering effort for lower frequency electronics plus a set of additional activities which are unique due to the higher frequency of operation. This resource presents you with the electronic packaging issues unique to microwave and millimeter-wave frequencies and reviews lower frequency packaging techniques so they can be adapted to higher frequency designs. You are provided with 30 practical examples throughout the book, as well as three free downloadable software analysis programs.

 

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Contents

1 Introduction
1
2 Materials
39
3 Ceramic Packaging
67
4 Laminate Packaging
91
5 FirstLevel Interconnects
107
6 SecondLevel Interconnects
143
7 Modules and Motherboards
161
8 Transitions and 3D Packaging
181
10 Electromagnetic Modeling
219
11 Conclusions and Future Horizons
233
Appendix A
241
Appendix B
245
Appendix C
249
About the Author
251
Index
253
Copyright

9 Heat Transfer
201

Common terms and phrases

About the author (2013)

Rick Sturdivant has 23 years of industry experience in the design of modules, packages, and integrated circuits for microwave and millimeter-wave applications. He currently works as a consultant and in business development. He earned his M.S. in electrical engineering from UCLA.

 

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