PCB Design Guide to Via and Trace Currents and Temperatures

Front Cover
Artech House, Feb 28, 2021 - Technology & Engineering - 246 pages

A very important part of printed circuit board (PCB) design involves sizing traces and vias to carry the required current. This exciting new book will explore how hot traces and vias should be and what board, circuit, design, and environmental parameters are the most important. PCB materials (copper and dielectrics) and the role they play in the heating and cooling of traces are covered. The IPC curves found in IPC 2152, the equations that fit those curves and computer simulations that fit those curves and equations are detailed.

 

Sensitivity analyses that show what happens when environments are varied, including adjacent traces and planes, changing trace lengths, and thermal gradients are presented. Via temperatures and what determines them are explored, along with fusing issues and what happens when traces are overloaded. Voltage drops across traces and vias, the thermal effects going around right-angle corners, and frequency effects are covered. Readers learn how to measure the thermal conductivity of dielectrics and how to measure the resistivity of copper traces and why many prior attempts to do so have been doomed to failure. Industrial CT Scanning, and whether or not they might replace microsections for measuring trace parameters are also considered.

 

Contents

Trace Heating and Cooling
28
of Trace Heating and through the dielectric convection through
30
IPC Curves
41
Thermal Simulations
51
Via Temperatures
89
Current Densities in Vias
109
Thinking Outside the Box
117
End Notes ture Almost anything we do from a real world board design standpoint tends
122
16
187
Appendix
199
Problem with Ohmmeter Measurement
206
Appendix C
213
Detailed Set of Equations for the Curves
219
Appendix
231
Simulation of Four Vias Proceeding Straight Ahead
237
Appendix
243

Background
125
Analyses
133
13
153
14
165
15
171
Our industry did not get reliable data
185
At first glance a PCB is a pretty simple thing
247
Appendix
253
About the Authors
261
The first study of the relationship between trace
269
Copyright

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About the author (2021)

Douglas Brooks has a BS/EE and an MS/EE from Stanford and a Ph.D. from the University of Washington. For the last 30 years he has owned a small engineering service firm and written numerous technical articles on Printed Circuit Board Design and Signal Integrity issues and has published two books on these topics.

Johannes Adam is the founder of AD-AM Research in Germany. He received his Ph.D. from the University of Heidelberg.

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