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Behavior of Soldered Joints in Printed Circuits
Shielded Wire Terminations
Quality Control Plan for Electrical Connections
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addition alloy aluminum applications assembly assure base bolting cause characteristics cleaned coating combination completely components conducted conductor connections connector considerable contact resistance continuity copper corrosion cycles determined drop effect electrical electronic environmental equipment evaluation exposure eyelet factors failure flux force gold heat improved inch included increase indicated initial insertion inspection installation insulation leads less limits lower manufacturers material mating measured mechanical metal method military necessary nickel obtained occur operation percent performance plated plug possible present pressure printed circuit boards problem production quality control range reduced relative reliability removed requirements resistance samples shown shows silver socket solder joint specification splice spring standard strength surface Table techniques temperature terminal thickness tion tool values vibration voltage weld wire