Quantum-well laser array packaging: nanoscale packaging techniques
Quantum-well lasers offer the promise of lightning-fast data communications - 10-to-100 times faster than broadband. While the architecture for these devices already exists, they suffer from material packaging problems. This book addresses this critical issue. It offers screening and packaging techniques useful for researchers.
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Martina Baeumler Fraunhofer Institut fiir Angewandte Festkorperphysik Freiburg
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absorption active layer active region aging tests AlGaAs analysis Appl band band-gap by-emitter catastrophic degradation cavity Chapter cladding layers coefficients compressive degra degradation modes device diode laser bars dislocation DLDs edge electroluminescence Electron emission emitting epitaxial expansion-matched experimental Figure GaAs gradual degradation heat heatsink heterostructure high-power diode laser high-power laser bars increase individual emitters induced strain InGaAs InGaAsP InGaP intrinsic strain J. W. Tomm laser arrays laser diodes laser structure LBIC Lett luminescence material measurement mechanisms microscopic mirror facets nonradiative recombination observed operation optical power output power packaging packaging-induced strain packaging-induced stress parameters PCS spectra peak photocurrent photoluminescence photon Phys point defects quantum rapid degradation sample screening semiconductor shift shown in Fig shows single emitters solder spectroscopy spectrum splitting channels strain fields substrate techniques temperature thermal thermal runaway tion u-PL waveguide wavelength