Rigid-Flex Printed Wiring Design for Production and Readiness
Follows the natural flow of product development beginning with planning, proceeding through the design and production stages, and concluding with product acceptance. In each case the impact that the decisions of each discipline have on the producibility and reliability of the design is analyzed. No
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Acrylic Adhesive additional adhesive layer applications artwork assembly base material bend bond plies bookbinder characteristics chemical circuitry clearance hole completely components conductive pattern conductor configuration conformal films connector construction copper foil Courtesy of Martin coverlayer criteria daughterboards Design Options desmearing dielectric dielectric constant Dielectric strength Dissipation factor double-sided drill edge electrical electroless electroplate epoxy etchback Figure flex flexible appendage flexible circuit flexible detail flexible layers flexible materials flexible section hardboard hole wall inch increase inspection installation interconnection interlayer bond Kapton lamination manufacturing Martin Marietta Corporation mechanical metal method Mil Polyimide Film minimum multilayer printed Orlando outer panel plated-through hole plating prepreg printed board printed wiring printed wiring board production master reduced reliability removed resin resist result rigid board rigid section rigid-flex circuit selection solder spacing specified stresses substrate film surface temperature terminal areas thermal thermoplastic thermosetting tion tooling water rinse wave solder