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SHEETMOLDED COMPOUND PROCESS IMPROVEMENT
INSTRUMENT PANEL PROCESS DEVELOPMENT
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accumulation analysis adhesion American Supplier Institute analysis of variance ANOVA Table assembly assigned average axial braking calculated cause-and-effect diagram conducted confirmation experiment connector cost Dearborn degrees of freedom Design of Experiments electrode error evaluate Figure Genichi Genichi Taguchi improvement Insig interactions Japanese Standards Association L16 orthogonal array layout Level 1 Level linear graph Loss Function material mean measured noise factors nominal-the-best operation optimization outer array parameter design performance plating thickness pull-off push-out force quality characteristics Quality Engineering radial temperature raw data reduce response table S/N Ratio S/N Ratio analysis samples selected shows signal factor Signal-to-Noise S/N significant factors simulation smaller-the-better solder Sonic Weld Source df sticky bits strip-force sum of squares surface defects Symposium on Taguchi Taguchi Methods target temperature difference travel distance tubing valve variability variation Voltage Spike wave soldering