The International Journal of Microcircuits and Electronic Packaging, Volume 25, Issue 1

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International Society for Hybrid Microelectronics, 2002 - Electronic packaging

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Contents

A Projection Moire System for Measuring Warpage with Case Studies
15
Mold Compound Adhesion to Bare Copper Lead Frames Effect of Laser Texturing
51
Development of a Novel Powder Cluster Wick Structure for LTCC Embedded Heat Pipes
80
Copyright

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