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A Projection Moire System for Measuring Warpage with Case Studies
Mold Compound Adhesion to Bare Copper Lead Frames Effect of Laser Texturing
Development of a Novel Powder Cluster Wick Structure for LTCC Embedded Heat Pipes
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adhesion strength alloy analysis Ball Grid Array bonding bump circuit board component junction temperature compound chemistry conductive adhesive conductors copper copper alloy copper lead frames creep strain cresol curvature delamination devices dual-curvature approach effect electrical Electrical Discharge Machining Electronic Components Electronic Packaging epoxy equations error experimental flexible circuit flip chip folding function heat transfer IMAPS Journal of Microcircuits junction temperature laser texturing laser treated laser treatment layer lEEE Transactions lGBT lnternational Microelectronics mass transport rate material properties maximum mass transport mechanical metal Microcircuits and Electronic Microelectronics And Packaging module mold encapsulation multilayer novolac Number ooo ooo ooo oooo oooo oooo oxidation package warpage Packaging Society passive component PBGA post mold cure power dissipation PQFP predictive accuracy projection moire RMSE samples shown in Figure simulations solder joint reliability stress structure substrate surface thermal conductivity thermomechanical thickness transient warpage