Thin Film Processes
Remarkable advances have been made in recent years in the science and technology of thin film processes for deposition and etching. It is the purpose of this book to bring together tutorial reviews of selected filmdeposition and etching processes from a process viewpoint. Emphasis is placed on the practical use of the processes to provide working guidelines for their implementation, a guide to the literature, and an overview of each process.
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A/min Abstr alloys anode Appl argon atoms cathode Chem chemical Chemical vapor deposition coatings composition compounds conﬁguration current density deposition rate effect efﬁciency electric Electrochem electron electroplating energy Epitaxial etch rate etchants etching processes ﬁlm deposition ﬁrst ﬂow rate ﬂux GaAs gas ﬂow gases glow discharge polymerization heat increase ion beam deposition ion etching ionization Kern layer magnetic ﬁeld magnetron mask metal mTorr nitride oxide photoresist Phys planar plasma etching plating PM sputtering pm/min polishing polymer polymer deposition potential pressure Proc produce proﬁle ratio RCA Rev reaction reactive reactive sputtering reactor reﬂected Semiconductors shown in Fig SiH4 silicon silicon nitride SiO2 solution species sputter deposition sputter etching Sputter Gun sputtering yield starting material stoichiometry substrate sufﬁcient susceptor techniques Technol temperature thermal thickness thin ﬁlm Thin Solid Films tion U.S. Patent uniform vacuum vapor voltage wafer York