Tribology of Abrasive Machining Processes

Front Cover
Recent and radically improved machining processes, from high wheel speeds to nanotechnology, have turned a spotlight on abrasive machining processes as a fertile area for further advancements. Written for researchers, students, engineers and technicians in manufacturing, this book presents a fundamental rethinking of important tribological elements of abrasive machining processes and their effects on process efficiency and product quality. Newer processes such as chemical mechanical polishing (CMP) and silicon wafer dicing can be better understood as tribological processes. Understanding the tribological principles of abrasive processes is crucial to discovering improvements in accuracy, production rate, and surface quality of products spanning all industries, from machine parts to ball bearings to contact lens to semiconductors.

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About the author (2008)

W. Brian Rowe is a consulting engineer and recognized bearing expert with more than 30 years’ experience working on a wide range of machinery design problems across all industries. He has previously run courses on bearings at Coventry University in the UK and Stanford University in the USA, as well as sessions on the topic for industrial engineers in Chengdu, China. He has received awards in recognition of his work, including the Walter R. Evans Award for significant contributions to the field of rotor dynamics in 2004.

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